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APC Technology to distribute 3D PLUS in UK and Ireland
Specialist technologies and electronic components designer, specifier and distributor APC Technology Group has signed an agreement to become the UK and Ireland distributor for 3D PLUS, a manufacturer of advanced high-density 3D microelectronics products for space applications, it announced on Monday.
The AIM-traded firm said 3D PLUS - a division of the New York-listed Heico - had an "impressive" 18-year heritage within the space sector, achieving preferred supplier status for the European Space Agency and sending more than 125,000 modules into space.
APC said its high-reliability component division APC Hi-Rel had "significant experience" in designing components for space programmes including ExoMars, BepiColombo and EarthCARE.
The addition of 3D PLUS products would enhance its range of space-qualified peripheral products such as DC-DC converters, optocouplers, crystal oscillators, capacitors, diodes and connectors, to now include 3D PLUS memory, interface and point of load converter products.
"APC Hi-Rel has a long history of working with organisations within the space, defence and medical sectors, which perfectly compliments our extensive product range," said Patrice Benard of 3D PLUS.
"Their technical and engineering expertise, and strong reputation within the industry, will be an asset to designing in 3D PLUS products to bring breakthrough advantages to customers' electronic designs."
Richard Hodgson, CEO of APC Technology Group, added that the combination of APC's existing space technologies, the premier space products that 3D PLUS would bring, APC's "prestigious" customers and its "experienced and knowledgeable" team would give the firm a solid base for expansion in the market.
"As we set out in our results presentation, we are concentrating on three main growth drivers: growth through increased bookings from our existing technologies, in particular those that sit in high growth markets; growth through the signing of new complementary product lines; and growth through targeted bolt-on acquisitions.
"We have just announced our first bolt on acquisition and the signing of 3D PLUS demonstrates real traction in the signing of new technologies."
The AIM-traded firm said 3D PLUS - a division of the New York-listed Heico - had an "impressive" 18-year heritage within the space sector, achieving preferred supplier status for the European Space Agency and sending more than 125,000 modules into space.
APC said its high-reliability component division APC Hi-Rel had "significant experience" in designing components for space programmes including ExoMars, BepiColombo and EarthCARE.
The addition of 3D PLUS products would enhance its range of space-qualified peripheral products such as DC-DC converters, optocouplers, crystal oscillators, capacitors, diodes and connectors, to now include 3D PLUS memory, interface and point of load converter products.
"APC Hi-Rel has a long history of working with organisations within the space, defence and medical sectors, which perfectly compliments our extensive product range," said Patrice Benard of 3D PLUS.
"Their technical and engineering expertise, and strong reputation within the industry, will be an asset to designing in 3D PLUS products to bring breakthrough advantages to customers' electronic designs."
Richard Hodgson, CEO of APC Technology Group, added that the combination of APC's existing space technologies, the premier space products that 3D PLUS would bring, APC's "prestigious" customers and its "experienced and knowledgeable" team would give the firm a solid base for expansion in the market.
"As we set out in our results presentation, we are concentrating on three main growth drivers: growth through increased bookings from our existing technologies, in particular those that sit in high growth markets; growth through the signing of new complementary product lines; and growth through targeted bolt-on acquisitions.
"We have just announced our first bolt on acquisition and the signing of 3D PLUS demonstrates real traction in the signing of new technologies."
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